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Job Description
Reporting to the Manager – CZT Polishing Operations, the successful applicant will assume a key role in maintaining and improving the processes used to fabricate Redlen’s CZT semiconductor radiation detector products.
Key Responsibilities
- Work within the Lap and Polish team to develop and optimize semiconductor fabrication processes including lapping, polishing, batch cleaning, and metrology
- Apply industrial engineering concepts and Lean principles to improve manufacturing efficiency and throughput
- Lead projects to purchase, characterize, and validate semiconductor equipment
- Provide manufacturing support to production technicians through troubleshooting of equipment and processes
- Root cause analysis and application of 6-Sigma methodology to identify and resolve underlying sources of yield loss
- Analyze process data and use statistics to draw meaningful conclusions
- Create and maintain process documentation (ex: Standard Operating Procedures) as well as technical reports
- Plan and execute design of experiments (DOEs) for process improvement activities
- Collaborate with other departments (R&D, Quality Assurance, etc.) to support new product introduction
Preferred Experience
- A minimum of 5 years’ experience in a manufacturing engineering role
- Semiconductor, biomedical, or sensor device fabrication
- Hands-on equipment experience and handling of delicate parts
- SQL database querying and statistical analysis using MiniTab or JMP software
- Use of Manufacturing Execution System (MES) software
Skills/Additional Requirements
- A very hands-on and innovative individual who works well in a team environment
- Outstanding interpersonal skills and excellent oral and written communication
- Great attention to detail, organization, and time management skills
- Able to manage numerous projects at once and direct daily activities to achieve results
Education
Engineering bachelor’s degree in mechanical, industrial, biomedical, nanotechnology, material science, or equivalent.
